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DART Contact Resonance Images of Cu-alloy/PC Board Junction

The topography and simultaneously measured contact resonance frequency and quality factor of the junction
between Cu-alloy and polymer PC-board layers. The layer was measured in the vicinity of a ball-grid array
(BGA) solder joint as part of a mechanical failure analysis test. The different mechanical properties of
the Cu alloy and the PCB resulted in a >100kHz contact resonance frequency shift between the two regions,
as well as significantly higher dissipation in the PCB material. 12µm scan. Imaged with the MFP-3D AFM.

Sample courtesy of Dr. Hahn, Korea Research Institute of Standards and Science, South Korea.